- Components & Features
- Component Features
- Component Applications
- -› Connectors & Contacts
- -› EMI / RFI Shielding
- -› Leadframes
- -› Electronics Packaging Components
- -› Frets & Harnesses
- -› Fuel Cell Plates
- -› Laminations
- -› Medical Implants, Needles & Instruments
- -› Meshes & Filters
- -› Microfluidic Components
- -› Microwave Components
- -› Optical Encoder Discs & Strips
- -› Printing Stencils & Foils
- -› Shims & Gaskets
- -› Springs
- -› Fotoboard 2®
- -› LEEF Multilayer Electroforming
- -› LEEF Micro Filters
- -› LEEF Optical Encoders
- -› LEEF Open Mesh
- -› LEEP Micro Forming
- -› LEEP Micro Channels
LEEF Open Mesh
Laser Evolved ElectroForming can produce 'open mesh components' in both hard and soft nickel.
Bar widths of <20 microns are achievable with ±2-3 micron tolerances and smooth sidewalls with less than 1:1 aspect ratios.
For further details on Laser Evolved ElectroForming please click here
