Processes

Below is an overview of the manufacturing technologies available at Precision Micro. Please click on the process name or use the left hand navigation menu for a detailed explanation of each of these processes.

	Photo Etching	LEEP	LEEF	Wire EDM
Materials	Almost all metals	Almost all metals	Predominantly Nickel	All metals providing they are conductive
Material thickness	0.025mm - 1.5mm	0.01mm - 1.5mm	Multilayer>0.5mm	0.01mm -250mm
Component sizes	Max 600mm x 1500mm	Max 800mm x 600mm	Max 590mm x 740mm	Max 254mm x 220mm (250mm high limit)
Tolerances	<0.025mm range	<0.010mm range	<0.005mm range	<0.010mm range
Volume / batch size	One to millions	One to millions	One to 1000's	One to 1000's
Minimum Feature	<0.050mm	<0.025mm	<0.01mm	<0.200mm

Please note that the above figures are given as a guideline. Should your component design fall outside these parameters please talk to one of our Technical Sales team who will be happy to talk through you requirements.