Processes

	Photo Etching	LEEP	Electroforming	LEEF	Wire EDM
Materials	Almost all metals. Click here for our full materials list	Almost all metals. Click here for our full materials list	Predominantly Nickel with a hardness up to 550 HV and noble metals on request	Predominantly Nickel with a hardness up to 550 HV and noble metals on request	All metal providing they are conductive
Material Thickness	0.01mm to 2mm	0.01mm to 2mm	0.015mm to 0.2mm	Multilayer >0.5mm	0.01mm to 250mm
Component sizes	Up to 600mm x 1500mm	Up to 800mm x 600mm	Up to 590mm x 740mm	Up to 590mm x 740mm	Up to 254mm x 220 mm (250mm high limit)
Tolerances**	In the 1/100mm range	1/1000 range	general +/-0.010 - 0.015mm	+/- 0.002 - 0.010mm	+/- 0.010 - 0.015mm
Min bar width**	Material thickness x 0.8	25 microns	Material thickness	15-20 microns	0.05mm
Min slot / hole width**	Material thickness, but not less than 0.05mm	25 microns	Material thickness	15-20 microns	0.150mm
Volume / Batch size	One to millions	One to millions	One to 1000's	One to 1000's	One to 1000's
Min Feature**	0.050mm	Surface features <25 microns	50 microns	15-20 microns	0.050 - 0.075mm

** Dependent on material thickness

Further available processes

Finishing

• Immense range of corrosion protective, dieelectric, conductivity enhancing or cosmetic finishes
• Grinding,polishing, linishing, vapour blasting and other post machining operations available

3Dpc

• Samples for evaluation and testing are available in hours
• Designs easily amended
• Low cost tooling reduces "entry costs" for smaller volume projects making them economically feasible